There's a lot of information about memory on the Internet, because all electronic products must use memory. However, there are several kinds of memory. What can we do to distinguish among them? This is a great article that clearly talks about their definitions and difference in detail. Hope you can learn a lot from it!
The entire development of distributed storage products can be divided into two phases. Test roles have different work in different product phase. This passage introduce the daily work of test engineers in detail, for example, designing and developing test cases. Of course, a good distributed storage product depends on cooperation of responsible test engineers, development engineers and operation e...
How do we test a distributed storage product? How many members need to work together before releasing a good distributed storage product. This article is written by an experienced test engineers to introduce change of test roles and problems in test practice. Let us read it carefully and learn something from it.
The entire development of distributed storage products can be divided into two phases. Test roles have different work in different product phase. This passage introduce the daily work of test engineers in detail, for example, designing and developing test cases. Of course, a good distributed storage product depends on cooperation of responsible test engineers, development engineers and operation e...
This article mainly tells us about basic components of photoresist, including polymer, solvent, photosensitive agent and additive. Photoresist can be divided into two types: positive photoresist and negative photoresist. Both of them have different features and application, and when choosing proper photoresist, you need to consider the resolution, aspect ratio, exposure speed and so on.
ASML, the leader in the field of lithography machine, monopolizes the high-end lithography machine market. As the technical threshold of the lithography machine is extremely high, few companies have the ability to produce high-end lithography machines. Therefore, it’s no wonder one EUV lithography machine is about $100 million, equivalent to F35, the fourth generation fighter of American Empire.
The technology of EUV is difficult to promote and its research and development requires a large of investment. Although speeding up EUV research and development means doubling expenditure, TSMC, Intel and Samsung are still willing to cooperate with ASML to speed up the development of EUV.
This article briefly introduces several reasons for the depression of Nikon and Canon and shows the structure and working principle of ASML lithography machine.
This part mainly introduces characteristics of various memory such as CF card, MMD card, SM card, and so on. Besides, the author gives some idea about how to select proper memory according to you requirements. Application requirements will determine the type of memory, but some design parameters including the microcontroller, voltage range, battery life also need to be considered.
The memory is divided into several types by hierarchical structure, targeting at resolving the contradiction between speed and cost reasonably. In addition, the article also shows how SPI managers to manage the memory in detail.
