Samsung released an industrial-grade SSD,PM1733, with the maximum capacity of 30.72TB. Samsung introduce new software into its latest PCIe 4.0 SSDs to make them so reliable. Through this technology, SSDs can achieve better voltage control on their own, thereby improving the stability and reliability of the entire driver.
NAND flash has evolved from SLC,MLC,TLC to QLC. The PLC SSD is coming now. The PLC NAND flash with 5-bit-per-cell and 32-level-cell is displayed at the China Flash Market Summit on September 19th. This means that PLC flash memory is beginning to emerge.
HIKVISION portable 1tb SSD with rounded disk-shaped structure has special appearance ,encrypting partition management and excellent read /write speed.
Samsung lunch new 30.72TB PCIe 4.0 SSD, PM1733, with the speed of Samsung PCIe 4.0 reaches an astonishing 7.19GB/s.
Max Shulaker recently presented a 3DIC wafer stacked with carbon nanotubes and RRAM stacked through ILV technology at the DARPA Electronic Revival Initiative (ERI) Summit. It is the first time that the carbon nanotubes and RRAM and ILV 3DIC technology have been officially processed by a third-party foundry, SkyWater Technology. That represents the carbon nanotubes and RRAM and ILV 3DIC technology...
Western Digital recently introduced a new slimmest SSD with the thickness of only 19.15mm in the series of My passport and My passport for Mac products. The 5TB SSD has a large capacity and can be used to store large number of photos, video and files.
Cerebras has launched the largest chip ever at IEEE Hot Chips seminar, It can reduce the AI training time from months to minutes. Cerebras build such a big chip because high-bandwidth and low-latency connections can only be achieved when data never have to leave the short, dense interconnect on the chip. Also, the core reduces the workload by simply not multiplying anything by zero. Cerebras will...
This article introduces the process node such 7nm, N7P, N7+, 6nm, N5P, 3nm and advanced chip packaging technology such as InFO package, 3D-MUST-in-MUST packaging technology, InFO packaged antenna (InFO_AiP), InFO_UHD, Integrated System Chip (SoIC). Integrated System Chip (SoIC) is TSMC's next-generation "real" 3D packaging technology. N7 can provide 3.3 times gate grid density and about 40% speed...
Tianjic chip is a new type of AI chip which has integrated the two main research trends of AI based on computer science and neuroscience-based methods into a platform which also supports machine learning algorithm and existing brain-inspired calculation algorithm.
Ethernet SSD not only is a storage tools but also can connect to the Internet. Toshiba and Marvell introduce an Ethernet SSD connecting directly to the Internet.The Ethernet SSD based on "88SS50000" controller is equipped with an 8TB capacity Toshiba 96-layer 3D TLC NAND flash and 128GB DDR4 cache.